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在線報價一
屬性
| Contact Finish - Mating | Gold |
|---|---|
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 30μin (0.76μm) |
| Contact Finish Thickness - Post | 30μin (0.76μm) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 68 (4 x 17) |
| Operating Temperature | -55°C ~ 105°C |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Termination | Solder |
| Type | CLCC |
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