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DIP324-014BLF| CONN IC DIP SOCKET 24POS TIN
DIP324-014BLF
描述 : CONN IC DIP SOCKET 24POS TIN
品牌 : Amphenol FCI
PDF : PDF
庫(kù)存: AVAIL
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屬性
| Contact Finish - Mating | Tin |
|---|---|
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 100μin (2.54μm) |
| Contact Finish Thickness - Post | 200μin (5.08μm) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Features | Open Frame |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Operating Temperature | - |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Termination | Solder |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
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